Home All Heat Sink Adhesive Tape and Grease

 

 

All standard heat sinks have options to include pre-applied thermal interface material upon request. The dimension of the thermal interface material will be 1mm smaller than the corresponding heat sink from each side. General guidelines for thermal interface material are available for reference.

For microprocessors, DC/DC converters and power modules, the phase change material is recommended. The material is rigid at room temperature and will get soften as the component reaches operating temperature. In additional, it has the ability to completely fill interface air gaps and voids presented in typical component package and heat sinks.

 

Phase Change Material

TypeStandand
Size
colorOperating
Temperature
(℃)
Thermal
impedance
(℃ -in2/W)
Thermal
conductivity
W/mK
ThicknessManufacturer
T725 pink -60 to +125 0.03 @ 50psi 0.7 0.13(mm) [0.005"] Chomerics
T710 light gray -60 to +125 0.1 @ 5psi 0.7 0.13(mm) [0.005"] Chomerics
Hi Flow 105 dark gray -30 to +120 0.37 @ 25psi 0.9 0.14(mm) [0.006"] Bergquist
PCS-TC-11 gray -40 to +125 0.04 @75um 3.8 0.13(mm) [0.005"] shin-ersu




For plastic molded IC package, Chomerics T411, and 3M 8810, 8815 are recommended. These tapes consist of a pressure-sensitive adhesive with an expanded aluminum mesh carrier layer or thermally conductive fillers and allows the tapes to conform well to non-flat substrates.

Double Sided Tape

TypeStandand
Size
colorOperating
Temperature
(℃)
Thermal
impedance
(℃ -in2/W)
Thermal
conductivity
W/mK
ThicknessManufacturer
T410 white -50 to +150 1.1 @ <1 psi   0.18(mm) [0.007"] ,PDF
T411 clear(silver) -50 to +150 1.0 @ <1 psi 0.5 0.28(mm) [0.011"] Chomerics
T412 gray -30 to +125 0.25 @ <1 psi 1.4 0.23(mm) [0.009"] Chomerics
8810 white   0.9 0.6 0.25(mm)
[0.01"]
3M, 8810
8815 white   1.2 0.6 0.375(mm) [0.015"] 3M, 8815


For plastic molded IC package, Chomerics T411, and 3M 8810, 8815 are recommended. These tapes consist of a pressure-sensitive adhesive with an expanded aluminum mesh carrier layer or thermally conductive fillers and allows the tapes to conform well to non-flat substrates.

Gap Filling Material

TypeStandand
Size
colorOperating
Temperature
(℃)
Thermal
impedance
(℃ -in2/W)
Thermal
conductivity
W/mK
ThicknessManufacturer
Li-98 white -30 to +120 1.0 @ <1 psi 0.95 0.15(mm) [0.006"] T-global
T-PCM905C yellow -25 to +125 0.048 @ 10psi 0.7 0.13(mm) [0.005"] Laird
T-PCM585 gray -40 to +125 0.02 @ <10 psi 3.8 0.13(mm) [0.005"] Laird
 



For special impedance request, we propose the grease PSX-D. Grease is suitable for heat sinks and variety of heat dissipating components. During the air flow, it expels from the interface which reduces thermal impedance and the material becomes highly thermal transferable.

Grease

TypecolorOperating
Temperature
(℃)
Thermal
impedance
(℃ -in2/W)
Thermal
conductivity
W/mK
WeightManufacturer
PSX-D gray -40 to 200 0.009 3.4   Henkel
SC102 white -45 to 200 0.62 @ 40psi 0.8 1g Dow Corning
STC 640 gray paste -50 to +155 0.012 @ 50psi 1.8 1g  
AS5 Silver Peak: –50 to >180
Long-Term: –50 to 130
<0.0045
(0.001 inch layer)
>350,000
(0.001 inch layer)
3.5g Arctic, >Arctic Silver® 5
CMQ-1G white Peak: –150 to >185
Long-Term: –150 to 130
<0.007
(0.001 inch layer)
>200,000
(0.001 inch layer)
1g Arctic, Céramique™ 2

Standard thermal pad and grease are shown in the table above. Additional materials to meet specific requirement are also available upon request.

Remark

Thermal pad or grease size is 1mm smaller than heat sink at every side .

For example :
Heat sink base 35x35mm(=A) , the thermal pad and thermal grease size will be at 33x33mm(=A-2).