Most of the opto-electronic package case consists of Kovar and Tungsten Copper base. Tungsten Copper has high thermal conductivity and low thermal expansion compared to other metals. It is also hard compared to KOVAR and stainless steel, which helps to strengthen the package. Due to the hard material property, Tungsten Copper is not easy to machine. It can wear out the tools quickly and make processing time long. Many attempts have been made to manufacture the housing by MIM process but without success. Again, it is due to its material property of low fluidity.
With our expertise in metal forming processes for over 30 years, Malico Inc. R&D team had overcome the challenges and successfully developed an innovative metal injection molding (MIM) process for Tungston-Copper material. With our process, we can form the entire opto-electronic package case in Tungston-Copper, replacing the KOVAR/Tungston-Copper approach. The package is stronger and has better heat dissipation which is critical as power dissipation becomes higher for higher frequency products. Malico Inc.’s MIM opto-electronic cases are near net shape as we can also preserve the cutouts for Feed through in the butterfly package (BTF). With our breakthrough, we can help our customers to achieve better pricing, lead time and performance for varieties of opto-electronic packages.
If you are interested to find out more, please send your drawings to us for quote.
